Objective:
To design an Electrostatic Chuck heater, which will have a uniform heating of wafer with a temperature difference of **% of the maximum temperature. To design an air cooling chamber so as to reduce the temperature to **C with cooling rate of **C per min.

Benefits:

• Air cooling units are used to achieve desired cooling instead of water cooling units.
• It saves liquid handling cost and high tolerances ,special gaskets are not required.
• Final prototype was build, tested and compared with CFD results and found close correlation.