- Detecting and mitigating thermal issues.
- Assessing performance under different temperature conditions.
- Ensuring product reliability in extreme environments.
AES team comprises highly skilled thermal engineers and subject matter experts. We have been helping electronics and semiconductor industries with their electronics cooling and testing needs for over a decade. As testing is an integral part of the product development lifecycle, the testing process and data validation are the main factors that essentially help in concluding the product performance and the correlation of numerical simulation.
Any electronic component must undergo TAPP (Thermal, Airflow, Power, and Performance) testing. The thermal testing outcome is the system's Thermal Design Power (TDP). The outcome of the flow testing is the flow rate and the pressure drops across the system under various flow conditions (natural and forced convection). Determining the system's Sound Pressure Level (SPL) is essential when using an anechoic chamber with ECMA-74 standards.
AES's Thermal solutions have proved to be invaluable for a wide range of industries, including automotive, electronics, pharmaceuticals, food and beverage, and many others. AES's commitment to leveraging cutting-edge technologies and extensive expertise makes us the ideal partner for OEMs and mass-production business owners who are looking to stay ahead in the race.